B.Basim;"Surface Chemistry-Mining to Microelectronics...", Jan.9,13:40
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  • B.Basim;"Surface Chemistry-Mining to Microelectronics...", Jan.9,13:40

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Faculty of Engineering and Natural Sciences
FENS MAT 551 SEMINARS

SURFACE CHEMISTRY- MINING TO MICROELECTRONICS AND BEYOND
G. Bahar Basim,
Texas Instruments Corporation, DMOS5, Dallas,TX USA

Colloids and surface chemistry fundamentals enable advances in science and industry from mining, petroleum, food, and agriculture to microelectronics, biological and pharmaceutical applications.  This talk will focus on a couple of specific applications extending from micro to nano scale. 

A traditional industrial example, where surface chemistry has been used effectively for many years is mineral processing.  Due to reduced prices, coal manufacturers reject minus 100m size particles due to tripled dewatering cost, resulting in environmental pollution as well as waste of energy resources.  Surface chemical modifications of fine coal through use of organic bi-products as dewatering aids reduced the moisture content of coal fines by half saving thermal budget.  In nano scale, chemical mechanical polishing (CMP) process sets a good example where stabilization of nano-particulates in severe chemical environments can be achieved through surface chemical modifications.  CMP is widely used in microelectronics industry to achieve planarization and patterning of metal and dielectric layers.  One of the main problems in CMP is defect formation as a result of the presence of larger size particles in the slurries.  Therefore, robust stabilization schemes are needed to stabilize the CMP slurries at extreme pH and ionic strength environments, under applied shear and normal forces.  Repulsive force barriers provided by the self-assembled surfactant structures at the solid/liquid interface can be utilized to enable stability by controlling not only the particle-particle interactions, but also the pad-particle-substrate interactions.  Once the process requirements are investigated at single particle-substrate level, thin film mechanics can be utilized to further refine the process capabilities.

Most recently, colloids and surface chemistry studies started to concentrate on biological systems through medical and pharmaceutical applications.  Controlled drug delivery, medicated contact lenses, drug detoxification are a few examples of the ongoing research studies in this field.  Advances in surface chemistry will continue to shed light into today’s problems and tomorrows needs by enabling more efficient industrial processes and unique scientific applications.

Bio:
Bahar Basim received her M.S. degree from Virginia Tech and PhD degree in materials science and engineering from the University of Florida in 2002 with specialties in surface chemistry, electronic materials and particle science and technology.  Her dissertation research focused on the design of engineered particulate systems for chemical-mechanical planarization applications.  As a part of the research group at the NSF-Engineering Research Center for Particle Science and Technology, her graduate work led to over 20 technical publications and a US patent application on the impact of slurry particulate properties on pad-particle-substrate interactions in CMP process.   She has been working on semiconductor development and manufacturing, including chemical mechanical planarization actively for past six years. Dr. Basim is currently working for Texas Instruments as a lead process engineer at DM5 wafer fab.  She serves as the defect team leader and she is a Group Member of TI Technical Staff.


January 9, 2008, 13:40, FENS G032