Faculty of Engineering and Natural Sciences
Thermal Management of Electronic Packages
University, Mechanical Engineering Department
Thermal design for cooling microprocessors has been one of the major concerns for semiconductor industry as the silicon technologies continue to evolve rapidly. Although power conscious designs are gaining more popularity, demand for higher performance, shrinking form factors and low cost designs are the main drivers behind the increase in local power densities challenging the thermal management strategies.
In the first part of the talk important aspects and definitions will be introduced in order to understand the problem more clearly. Some novel alternative technologies to achieve enhanced cooling of the package will also be reviewed. Some of these technologies are implemented within the package while others that are referred as “enabling solutions” are attached to the package as in the case of a heat sink.
The second part of the talk will focus on non-destructive thermal characterization of packages. One of the most important functions of an electronic package is thermal management, as package is responsible from removing the heat generated by the transistors to ensure reliability. The quality of the package is very important for proper thermal management and it is important to have minimal amount flaws that increase thermal resistance of the package. Therefore, detection of flaws in the multi-layered package is critical during the assembly process development to monitor the package quality. This is achieved by techniques such as computerized tomography (CT) using xrays, or scanning acoustic microscopy (SAM), all of which require very expansive equipment and significant process time. Thermal diffusion tomography (TDT) can be used for detecting the flaws as a lower cost alternative to these imaging techniques. The feasibility of TDT as a fault detection technique for electronic packages with IR thermometry is considered in the current presentation. Two reconstruction algorithms are considered; an iterative perturbation approach and Levenberg-Marquard method were found to be capable of detecting the flaws in the thermal interface layer.
Ph.D.: Department of Mechanical Engineering, the University of Texas at Austin, Austin, TX, USA, 2002
M.S.: Department of Mechanical Engineering, Middle East Technical University, Ankara, Turkey, 1997
B.S.: Department of Mechanical Engineering, Middle East Technical University, Ankara, Turkey, 1994
2007-present: Assistant Professor, Department of Mechanical Engineering, Bogazici University, Istanbul
2003-2007: Senior Packaging Engineer, Assembly, Test and Technology Development, Intel Corporation, Chandler, AZ, USA.
1998-2002: Research Assistant, Department of Mechanical Engineering, the
Texas at Austin,
1994-1998: Teaching Assistant, Department of Mechanical Engineering,
April 15, 2009, 13:40,