Solid State Lighting Technologies with LEDS: Technology Trends, Opportunities and Bottlenecks
Mehmet Arik, PhD
Faculty of Engineering
Since the invention of the visible light emitting diodes (LEDs) in 1962, by Nick Holonyak at GE, LED technology has evolved from a low power, single color, and optical indicator to a high power, illumination quality lighting source, covering the entire visible spectrum. This evolution has brought the need to develop new packaging technologies capable of handling the associated high thermal and optical fluxes. While a variety of colors and impressive lumens have been recently possible, LEDs started replacing conventional lighting starting with signage, traffic lights, outdoor and indoor lighting applications. Efficacy of an LED system today may exceeds 65 lumen/W compared to a 5x improvement over incandescent lamps and 20% to compact fluorescent lamps (CFL)). Another fascinating feature of those LEDs are the expected lifetimes in excess of 50000 hours which is 5 times longer than CFL lamps and 0ver 40 times longer than incandescent. With this impressive features, it is not hard to expect them replace general lighting at an accelerated rate. Recently GE Corporate R&D Center (NY) made a press release for a 1500 lumen LED down light system that is cheaper, smaller and much lighter than comparable LED down lights showing that technology can enable presentable SSL products at an affordable cost for end-users. In this presentation, an overview of LED lighting technology including chip, packaging, phosphor, thermal management and electronics will be presented. Novel thermal technologies followed by physics of failure (PoF) for LEDs will also be discussed.
Dr. Mehmet Arik obtained his BSc degree in mechanical engineering from İstanbul Technical University, İstanbul. He completed MSc degree at the University of Miami, Miami, in 1996. His PhD degree was awarded at the University of Minnesota, focusing on the thermal management of high flux electronic components and Microelectromechanical systems (MEMS), in 2001.Since 2000, he has worked at the General Electric Global Research Center in Niskayuna, NY, on the thermal management of electronics as a senior research scientist and project leader. He has performed research in air-cooled and liquid cooled power electronics, photonics packages, microfluidic systems, defense systems, energy technologies, medical systems and LEDs. He is a member of ASME and IEEE. He is an ASME fellow. He holds over thirty five US patents and many more are pending. He published over 80 papers in international journals and conferences in the fields of electronics cooling, energy systems, and MEMS. Dr Arık serves as associate editor for both IEEE Components and Packaging Technologies and ASME Thermal Scıences and Engıneerıng Applıcatıons journals.